TivaTM C Series TM4C123G LaunchPad Evaluation Board
User’s Guide
Literature Number: SPMU296 April 2013
Contents
1 Board Overview …………………………………………………………………………………………………… 4
1.1 Kit Contents …………………………………………………………………………………………………… 5
1.2 Using the Tiva C Series LaunchPad …………………………………………………………………………. 5
1.3 Features ………………………………………………………………………………………………………. 5
1.4 BoosterPacks …………………………………………………………………………………………………. 6
1.5 Specifications …………………………………………………………………………………………………. 6
2 Hardware Description ……………………………………………………………………………………………. 7
2.1 Functional Description ………………………………………………………………………………………… 7
2.1.1 Microcontroller ………………………………………………………………………………………… 7
2.1.2 USB Connectivity …………………………………………………………………………………….. 8
2.1.3 Motion Control ………………………………………………………………………………………… 8
2.1.4 User Switches and RGB User LED …………………………………………………………………… 9
2.1.5 Headers and BoosterPacks …………………………………………………………………………… 9
2.2 Power Management …………………………………………………………………………………………. 11
2.2.1 Power Supplies ……………………………………………………………………………………… 11
2.2.2 Hibernate ……………………………………………………………………………………………. 11
2.2.3 Clocking ……………………………………………………………………………………………… 12
2.2.4 Reset ………………………………………………………………………………………………… 12
2.3 In-Circuit Debug Interface (ICDI) ……………………………………………………………………………. 12
2.3.1 Virtual COM Port ……………………………………………………………………………………. 12
3 Software Development …………………………………………………………………………………………. 13
3.1 Software Description ………………………………………………………………………………………… 13
3.2 Source Code ………………………………………………………………………………………………… 13
3.3 Tool Options …………………………………………………………………………………………………. 13
3.4 Programming the Tiva C Series LaunchPad Evaluation Board …………………………………………….. 14
4 References, PCB Layout, and Bill of Materials ……………………………………………………………. 15
4.1 References ………………………………………………………………………………………………….. 15
4.2 Component Locations ……………………………………………………………………………………….. 16
4.3 Bill of Materials (BOM) ………………………………………………………………………………………. 17
A Schematics ……………………………………………………………………………………………………….. 19
2 Contents
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List of Figures
1-1. Tiva C Series TM4C123G LaunchPad Evaluation Board…………………………………………………….. 4 2-1. Tiva C Series LaunchPad Evaluation Board Block Diagram…………………………………………………. 7
4-1. Tiva C Series LaunchPad Component Locations (Top View) ………………………………………………. 16
4-2. Tiva C Series LaunchPad Dimensions ……………………………………………………………………… 17
List of Tables
1-1. EK-TM4C123GXL Specifications …………………………………………………………………………….. 6
2-1. USB Device Signals ………………………………………………………………………………………….. 8
2-2. User Switches and RGB LED Signals ……………………………………………………………………….. 9
2-3. J1 Connector …………………………………………………………………………………………………. 9
2-4. J2 Connector ………………………………………………………………………………………………… 10
2-5. J3 Connector ………………………………………………………………………………………………… 10
2-6. J4 Connector ………………………………………………………………………………………………… 11
2-7. In-Circuit Debug Interface (ICDI) Signals …………………………………………………………………… 12
2-8. Virtual COM Port Signals ……………………………………………………………………………………. 12
4-1. EK-TM4C123GXL Bill of Materials …………………………………………………………………………. 17
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Chapter 1 SPMU296–April 2013
Board Overview
The TivaTM C Series TM4C123G LaunchPad Evaluation Board (EK-TM4C123GXL) is a low-cost evaluation platform for ARM® CortexTM-M4F-based microcontrollers. The Tiva C Series LaunchPad design highlights the TM4C123GH6PMI microcontroller USB 2.0 device interface, hibernation module, and motion control pulse-width modulator (MC PWM) module. The Tiva C Series LaunchPad also features programmable user buttons and an RGB LED for custom applications. The stackable headers of the Tiva C Series TM4C123G LaunchPad BoosterPack XL interface demonstrate how easy it is to expand the functionality of the Tiva C Series LaunchPad when interfacing to other peripherals on many existing BoosterPack add-on boards as well as future products. Figure 1-1 shows a photo of the Tiva C Series LaunchPad.
Figure 1-1. Tiva C Series TM4C123G LaunchPad Evaluation Board
Power Select Switch
USB Connector (Power/ICDI)
Green Power LED
Tiva TM4C123GH6PMI Microcontroller
USB Micro-A/-B Connector (Device)
Tiva C Series LaunchPad BoosterPack XL Interface (J1, J2, J3, and J4 Connectors)
MSP430 LaunchPad-Compatible BoosterPack Interface
Reset Switch
RGB User LED
Tiva C Series LaunchPad BoosterPack XL Interface (J1, J2, J3, and J4 Connectors)
Tiva TM4C123GH6PMI Microcontroller
MSP430 LaunchPad-Compatible BoosterPack Interface
Tiva, MSP430, Code Composer Studio are trademarks of Texas Instruments. Cortex is a trademark of ARM Limited.
ARM, RealView are registered trademarks of ARM Limited.
Microsoft, Windows are registered trademarks of Microsoft Corporation.
All other trademarks are the property of their respective owners. 4 Board Overview
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User Switch 1
User Switch 2
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Kit Contents
1.1 Kit Contents
The Tiva C Series TM4C123G LaunchPad Evaluation Kit contains the following items:
• Tiva C Series LaunchPad Evaluation Board (EK-TM4C123GXL)
• On-board In-Circuit Debug Interface (ICDI)
• USB micro-B plug to USB-A plug cable
• README First document
1.2 Using the Tiva C Series LaunchPad
The recommended steps for using the Tiva C Series TM4C123G LaunchPad Evaluation Kit are:
1. Follow the README First document included in the kit. The README First document will help you get the Tiva C Series LaunchPad up and running in minutes. See the Tiva C Series LaunchPad web page for additional information to help you get started.
2. Experiment with LaunchPad BoosterPacks. A selection of Tiva C Series BoosterPacks and compatible MSP430TM BoosterPacks can be found at the TI MCU LaunchPad web page.
3. Take your first step toward developing an application with Project 0 using your preferred ARM tool-chain and the Tiva C Series TivaWare Peripheral Driver Library. Software applications are loaded using the on-board In-Circuit Debug Interface (ICDI). See Chapter 3, Software Development, for the programming procedure. The TivaWare for C Series Peripheral Driver Library Software Reference Manual contains specific information on software structure and function. For more information on Project 0, go to the Tiva C Series LaunchPad wiki page.
4. Customize and integrate the hardware to suit an end application. This user’s manual is an important reference for understanding circuit operation and completing hardware modification.
You can also view and download almost six hours of training material on configuring and using the LaunchPad. Visit the Tiva C Series LaunchPad Workshop for more information and tutorials.
1.3 Features
Your Tiva C Series LaunchPad includes the following features:
• Tiva TM4C123GH6PMI microcontroller
• Motion control PWM
• USB micro-A and micro-B connector for USB device, host, and on-the-go (OTG) connectivity
• RGB user LED
• Two user switches (application/wake)
• Available I/O brought out to headers on a 0.1-in (2.54-mm) grid
• On-board ICDI
• Switch-selectable power sources:
– ICDI
– USB device
• Reset switch
• Preloaded RGB quickstart application
• Supported by TivaWare for C Series software including the USB library and the peripheral driver library
• Tiva C Series TM4C123G LaunchPad BoosterPack XL Interface, which features stackable headers to expand the capabilities of the Tiva C Series LaunchPad development platform
– For a complete list of available BoosterPacks that can be used with the Tiva C Series LaunchPad, see the LaunchPad web page.
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Board Overview 5
BoosterPacks www.ti.com 1.4 BoosterPacks
The Tiva C Series LaunchPad provides an easy and inexpensive way to develop applications with the TM4C123GH6PM microcontroller. Tiva C Series BoosterPacks and MSP430 BoosterPacks expand the available peripherals and potential applications of the Tiva C Series LaunchPad. BoosterPacks can be used with the Tiva C Series LaunchPad or you can simply use the on-board TM4C123GH6PM microcontroller as its processor. See Chapter 2 for more information.
Build your own BoosterPack and take advantage of Texas Instruments’ website to help promote it! From sharing a new idea or project, to designing, manufacturing, and selling your own BoosterPack kit, TI offers a variety of avenues for you to reach potential customers with your solutions.
1.5 Specifications
Table 1-1 summarizes the specifications for the Tiva C Series LaunchPad. Table 1-1. EK-TM4C123GXL Specifications
Parameter
Value
Board supply voltage
4.75 VDC to 5.25 VDC from one of the following sources:
• Debugger (ICDI) USB Micro-B cable (connected to a PC)
• USB Device Micro-B cable (connected to a PC)
Dimensions
2.0 in x 2.25 in x 0.425 in (5.0 cm x 5.715 cm x 10.795 mm) (L x W x H)
Break-out power output
• 3.3 VDC (300 mA max)
• 5.0 VDC (depends on 3.3 VDC usage, 23 mA to 323 mA)
RoHS status
Compliant
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Chapter 2 SPMU296–April 2013
Hardware Description
The Tiva C Series LaunchPad includes a TM4C123GH6PM microcontroller and an integrated ICDI as well as a range of useful peripheral features (as the block diagram in Figure 2-1 shows). This chapter describes how these peripherals operate and interface to the microcontroller.
Figure 2-1. Tiva C Series LaunchPad Evaluation Board Block Diagram
Debug Breakout Pads
I/O
I/O
JTAG/SWD UART0
TM4C123GH6PMI
USB
VDD
HIB WAKE
GPIO
GPIO
GPIO
GPIO
ICDI
USB Debug Connector
USB Device Connector
Power Select Switch
2.1 Functional Description
2.1.1 Microcontroller
Power Management
Breakout Pads
The TM4C123GH6PM is a 32-bit ARM Cortex-M4-based microcontroller with 256-kB Flash memory, 32- kB SRAM, and 80-MHz operation; USB host, device, and OTG connectivity; a Hibernation module and PWM; and a wide range of other peripherals. See the TM4C123GH6PM microcontroller data sheet (literature number SPMS376) for complete device details.
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RGB LED
User Switches
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Hardware Description 7
Device
ICDI
MSP430TM LaunchPad-Compatible Expansion Headers
TivaTM C Series LaunchPad-Specific BoosterPackXL Expansion Headers
Functional Description www.ti.com
2.1.2
Most of the microcontroller signals are routed to 0.1-in (2.54-mm) pitch headers. An internal multiplexer allows different peripheral functions to be assigned to each of these GPIO pads. When adding external circuitry, consider the additional load on the evaluation board power rails.
The TM4C123GH6PM microcontroller is factory-programmed with a quickstart demo program. The quickstart program resides in on-chip Flash memory and runs each time power is applied, unless the quickstart application has been replaced with a user program.
USB Connectivity
The EK-TM4C123GXL is designed and functions as a USB device without hardware modification. The USB device signals are dedicated to USB functionality and are not shared with the BoosterPack headers. The USB device signals are listed in Table 2-1.
Table 2-1. USB Device Signals
The TM4C123GH6PM target device is also capable of USB embedded host and on-the-go (OTG) functions. OTG functionality can be enabled by populating R25 and R29 with 0-Ω resistors. These resistors connect the USB ID and USB VBUS signals to PB0 and PB1. When these resistors are populated, PB0 and PB1 must remain in the respective USB pin mode configurations to prevent device damage. PB0 and PB1 are also present on the J1 BoosterPack header. Therefore, if R25 or R29 are populated, care must be taken not to conflict these signals with BoosterPack signals.
USB embedded host operation can be enabled in the same way for USB devices that are self-powered. Providing power when acting as a USB host requires a BoosterPack with power switching and appropriate connectors. All USB host signals are available on the BoosterPack interface except D+ and D–, which are only available on the USB micro-A/-B connector and the two adjacent test points.
When connected as a USB device, the evaluation board can be powered from either the ICDI or the USB Device connectors. The user can select the power source by moving the POWER SELECT switch (SW3) to the Device position. See the Power Management schematic (appended to this document).
Motion Control
The EK-TM4C123GXL includes the Tiva C-Series Motion Control PWM technology, featuring two PWM modules capable of generating 16 PWM outputs. Each PWM module provides a great deal of flexibility and can generate simple PWM signals—for example, those required by a simple charge pump—as well as paired PWM signals with dead-band delays, such as those required by a half-H bridge driver. Three generator blocks can also generate the full six channels of gate controls required by a 3-phase inverter bridge.
Two quadrature encoder interfaces (QEI) are also available to provide motion control feedback. See the Headers and BoosterPacks section of this document for details about the availability of these signals on the BoosterPack interface.
GPIO Pin
Pin Function
USB Device
PD4
USB0DM
D–
PD5
USB0DP
D+
2.1.3
8
Hardware Description
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2.1.4
User Switches and RGB User LED
The Tiva C Series LaunchPad comes with an RGB LED. This LED is used in the preloaded RGB quickstart application and can be configured for use in custom applications.
Two user buttons are included on the board. The user buttons are both used in the preloaded quickstart application to adjust the light spectrum of the RGB LED as well as go into and out of hibernation. The user buttons can be used for other purposes in the user’s custom application.
The evaluation board also has a green power LED. Table 2-2 shows how these features are connected to the pins on the microcontroller.
Table 2-2. User Switches and RGB LED Signals
Headers and BoosterPacks
The two double rows of stackable headers are mapped to most of the GPIO pins of the TM4C123GH6PM microcontroller. These rows are labeled as connectors J1, J2, J3, and J4. Connectors J3 and J4 are located 0.1 in (2.54 mm) inside of the J1 and J2 connectors. All 40 header pins of the J1, J2, J3, and J4 connectors make up the Tiva C Series TM4C123G LaunchPad BoosterPack XL Interface. Table 2-3 through Table 2-6 show how these header pins are connected to the microcontroller pins and which GPIO functions can be selected.
NOTE: To configure the device peripherals easily and intuitively using a graphical user interface (GUI), see the Tiva C Series Pinmux Utility found at www.ti.com/tool/lm4f_pinmux. This easy- to-use interface makes setting up alternate functions for GPIOs simple and error-free.
Table 2-3. J1 Connector(1)
GPIO Pin
Pin Function
USB Device
PF4
GPIO
SW1
PF0
GPIO
SW2
PF1
GPIO
RGB LED (Red)
PF2
GPIO
RGB LED (Blue)
PF3
GPIO
RGD LED (Green)
2.1.5
J1 Pin
GPIO
Analog Function
On- board Function
Tiva C Series MCU Pin
GPIOPCTL Register Setting
GPIO AMSEL
1
2
3
4
5
6
7
8
9
14
15
1.01
3.3 V
1.02
PB5
AIN11
–
57
–
SSI2Fss
–
M0PWM3
–
–
T1CCP1
CAN0Tx
–
–
–
1.03
PB0
USB0ID
–
45
U1Rx
–
–
–
–
–
T2CCP0
–
–
–
–
1.04
PB1
USB0VBUS
–
46
U1Tx
–
–
–
–
–
T2CCP1
–
–
–
–
1.05
PE4
AIN9
–
59
U5Rx
–
I2C2SCL
M0PWM4
M1PWM2
–
–
CAN0Rx
–
–
–
1.06
PE5
AIN8
–
60
U5Tx
–
I2C2SDA
M0PWM5
M1PWM3
–
–
CAN0Tx
–
–
–
1.07
PB4
AIN10
–
58
–
SSI2Clk
–
M0PWM2
–
–
T1CCP0
CAN0Rx
–
–
–
1.08
PA5
–
–
22
–
SSI0Tx
–
–
–
–
–
–
–
–
–
1.09
PA6
–
–
23
–
–
I2C1SCL
–
M1PWM2
–
–
–
–
–
–
1.10
PA7
–
–
24
–
–
I2C1SDA
–
M1PWM3
–
–
–
–
–
–
(1) Shaded cells indicate configuration for compatibility with the MSP430 LaunchPad.
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Table 2-4. J2 Connector(1)
J2 Pin
GPIO
Analog Function
On-board Function
Tiva C Series MCU Pin
GPIOPCTL Register Setting
GPIO AMSEL
1
2
3
4
5
6
7
8
9
14
15
2.01
GND
2.02
PB2
–
–
47
–
–
I2C0SCL
–
–
–
T3CCP0
–
–
–
–
2.03
PE0
AIN3
–
9
U7Rx
–
–
–
–
–
–
–
–
–
–
2.04
PF0
–
USR_SW2/ WAKE (R1)
28
U1RTS
SSI1Rx
CAN0Rx
–
M1PWM4
PhA0
T0CCP0
NMI
C0o
–
–
2.05
RESET
2.06
PB7
–
–
4
–
SSI2Tx
–
M0PWM1
–
–
T0CCP1
–
–
–
–
PD1
AIN6
Connected for MSP430 Compatibility (R10)
62
SSI3Fss
SSI1Fss
I2C3SDA
M0PWM7
M1PWM1
–
WT2CCP1
–
–
–
–
2.07
PB6
–
–
1
–
SSI2Rx
–
M0PWM0
–
–
T0CCP0
–
–
–
–
PD0
AIN7
Connected for MSP430 Compatibility (R9)
61
SSI3Clk
SSI1Clk
I2C3SCL
M0PWM6
M1PWM0
–
WT2CCP0
–
–
–
–
2.08
PA4
–
–
21
–
SSI0Rx
–
–
–
–
–
–
–
–
–
2.09
PA3
–
–
20
–
SSI0Fss
–
–
–
–
–
–
–
–
–
2.10
PA2
–
–
19
–
SSI0Clk
–
–
–
–
–
–
–
–
–
(1) Shaded cells indicate configuration for compatibility with the MSP430 LaunchPad.
Table 2-5. J3 Connector(1)
J3 Pin
GPIO
Analog Function
On-board Function
Tiva C Series MCU Pin
GPIOPCTL Register Setting
GPIO AMSEL
1
2
3
4
5
6
7
8
9
14
15
3.01
5.0 V
3.02
GND
3.03
PD0
AIN7
–
61
SSI3Clk
SSI1Clk
I2C3SCL
M0PWM6
M1PWM0
–
WT2CCP0
–
–
–
–
PB6
–
Connected for MSP430 Compatibilit y (R9)
1
–
SSI2Rx
–
M0PWM0
–
T0CCP0
–
–
–
–
3.04
PD1
AIN6
–
92
SSI3Fss
SSI1Fss
I2C3SDA
M0PWM7
M1PWM1
–
WT2CCP1
–
–
–
–
PB7
–
Connected for MSP430 Compatibilit y (R10)
4
–
SSI2Tx
–
M0PWM1
–
–
T0CCP1
–
–
–
–
3.05
PD2
AIN5
63
SSI3Rx
SSI1Rx
–
M0FAULT0
–
–
WT3CCP0
USB0EPE N
3.06
PD3
AIN4
–
64
SSI3Tx
SSI1Tx
–
–
–
–
WT3CCP1
USB0PFLT
–
–
–
3.07
PE1
AIN2
–
8
U7Tx
–
–
–
–
–
–
–
–
–
3.08
PE2
AIN1
–
7
–
–
–
–
–
–
–
–
–
–
–
3.09
PE3
AIN0
–
6
–
–
–
–
–
–
–
–
–
–
–
3.10
PF1
–
–
29
U1CTS
SSI1Tx
–
–
M1PWM5
–
T0CCP1
–
C1o
TRD1
–
(1) Shaded cells indicate configuration for compatibility with the MSP430 LaunchPad.
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Power Management
Table 2-6. J4 Connector
J4 Pin
GPIO
Analog Function
On- board Function
Tiva C Series MCU Pin
GPIOPCTL Register Setting
GPIO AMSEL
1
2
3
4
5
6
7
8
9
14
15
4.01
PF2
–
Blue LED (R11)
30
–
SSI1Clk
–
M0FAULT0
M1PWM6
–
T1CCP0
–
–
–
TRD0
4.02
PF3
–
Green LED (R12)
31
–
SSI1Fss
CAN0Tx
–
M1PWM7
–
T1CCP1
–
–
–
TRCLK
4.03
PB3
–
–
48
–
–
I2C0SDA
–
–
–
T3CCP1
–
–
–
–
4.04
PC4
C1–
–
16
U4Rx
U1Rx
–
M0PWM6
–
IDX1
WT0CCP0
U1RTS
–
–
–
4.05
PC5
C1+
–
15
U4Tx
U1Tx
–
M0PWM7
–
PhA1
WT0CCP1
U1CTS
–
–
–
4.06
PC6
C0+
–
14
U3Rx
–
–
–
–
PhB1
WT1CCP0
USB0EPE N
–
–
–
4.07
PC7
C0–
–
13
U3Tx
–
–
–
–
–
WT1CCP1
USB0PFLT
–
–
–
4.08
PD6
–
–
53
U2Rx
–
–
–
–
PhA0
WT5CCP0
–
–
–
–
4.09
PD7
–
–
10
U2Tx
–
–
–
–
PhB0
WT5CCP1
NMI
–
–
–
4.10
PF4
–
USR_SW 1 (R13)
5
–
–
–
–
M1FAULT0
IDX0
T2CCP0
USB0EPE N
–
–
–
2.2
2.2.1
Connectors J1 and J2 of the Tiva C Series TM4C123G LaunchPad BoosterPack XL Interface provide compatibility with MSP430 LaunchPad BoosterPacks. Highlighted functions (shaded cells) in Table 2-3 through Table 2-5 indicate configuration for compatibility with the MSP430 LaunchPad.
A complete list of Tiva C Series BoosterPacks and Tiva C Series LaunchPad-compatible MSP430 BoosterPacks is available at www.ti.com/tm4c123g-launchpad.
Power Management
Power Supplies
The Tiva C Series LaunchPad can be powered from one of two power sources:
• On-board ICDI USB cable (Debug, Default)
• USB device cable (Device)
The POWER SELECT switch (SW3) is used to select one of the two power sources. Select only one source at a time.
2.2.2 Hibernate
The Tiva C Series LaunchPad provides an external 32.768-kHz crystal (Y1) as the clock source for the TM4C123GH6PM Hibernation module clock source. The current draw while in Hibernate mode can be measured by making some minor adjustments to the Tiva C Series LaunchPad. This procedure is explained in more detail later in this section.
The conditions that can generate a wake signal to the Hibernate module on the Tiva C Series LaunchPad are waking on a Real-time Clock (RTC) match and/or waking on assertion of the WAKE pin. (1) The second user switch (SW2) is connected to the WAKE pin on the microcontroller. The WAKE pin, as well as the VDD and HIB pins, are easily accessible through breakout pads on the Tiva C Series LaunchPad. See the appended schematics for details.
spacer spacer spacer
spacer
(1) If the board does not turn on when you connect it to a power source, the microcontroller might be in Hibernate mode (depending on the programmed application). You must satisfy one of the programmed wake conditions and connect the power to bring the microcontroller out of Hibernate mode and turn on the board.
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Hardware Description 11
In-Circuit Debug Interface (ICDI) www.ti.com
There is no external battery source on the Tiva C Series LaunchPad Hibernation module, which means the VDD3ON power control mechanism should be used. This mechanism uses internal switches to remove power from the Cortex-M4 processor as well as to most analog and digital functions while retaining I/O pin power.
To measure the Hibernation mode current or the Run mode current, the VDD jumper that connects the 3.3 V pin and the MCU_PWR pin must be removed. See the complete schematics (appended to this document) for details on these pins and component locations. An ammeter should then be placed between the 3.3 V pin and the MCU_PWR pin to measure IDD (or IHIB_VDD3ON). The TM4C123GH6PM microcontroller uses VDD as its power source during VDD3ON Hibernation mode, so IDD is the Hibernation mode (VDD3ON mode) current. This measurement can also be taken during Run mode, which measures IDD the microcontroller running current.
2.2.3 Clocking
The Tiva C Series LaunchPad uses a 16.0-MHz crystal (Y2) to complete the TM4C123GH6PM microcontroller main internal clock circuit. An internal PLL, configured in software, multiples this clock to higher frequencies for core and peripheral timing.
The Hibernation module is clocked from an external 32.768-KHz crystal (Y1).
2.2.4 Reset
2.3
The RESET signal into the TM4C123GH6PM microcontroller connects to the RESET switch and to the ICDI circuit for a debugger-controlled reset.
External reset is asserted (active low) under any of three conditions:
• Power-on reset (filtered by an R-C network)
• RESET switch held down
• By the ICDI circuit when instructed by the debugger (this capability is optional, and may not be supported by all debuggers)
In-Circuit Debug Interface (ICDI)
The Tiva C Series LaunchPad evaluation board comes with an on-board In-Circuit Debug Interface (ICDI). The ICDI allows for the programming and debug of the TM4C123GH6PM using the LM Flash Programmer and/or any of the supported tool chains. Note that the ICDI supports only JTAG debugging. An external debug interface can be connected for Serial Wire Debug (SWD) and SWO (trace).
Table 2-7 shows the pins used for JTAG and SWD. These signals are also mapped out to easily accessible breakout pads and headers on the board.
Table 2-7. In-Circuit Debug Interface (ICDI) Signals
Virtual COM Port
When plugged in to a PC, the device enumerates as a debugger and a virtual COM port. Table 2-8 shows the connections for the COM port to the pins on the microcontroller.
GPIO Pin
Pin Function
PC0
TCK/SWCLK
PC1
TMS/SWDIO
PC2
TDI
PC3
TDO/SWO
2.3.1
Table 2-8. Virtual COM Port Signals
GPIO Pin
Pin Function
PA0
U0RX
PA1
U0TX
12
Hardware Description
SPMU296–April 2013
Copyright © 2013, Texas Instruments Incorporated
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Chapter 3 SPMU296–April 2013
Software Development
This chapter provides general information on software development as well as instructions for Flash memory programming.
3.1 Software Description
The TivaWare software provided with the Tiva C Series LaunchPad provides access to all of the peripheral devices supplied in the design. The Tiva C Series Peripheral Driver Library is used to operate the on-chip peripherals as part of TivaWare.
TivaWare includes a set of example applications that use the TivaWare Peripheral Driver Library. These applications demonstrate the capabilities of the TM4C123GH6PM microcontroller, as well as provide a starting point for the development of the final application for use on the Tiva C Series LaunchPad evaluation board.
3.2 Source Code
The complete source code including the source code installation instructions are provided at www.ti.com/tm4c123g-launchpad. The source code and binary files are installed in the DriverLib tree.
3.3 Tool Options
The source code installation includes directories containing projects and/or makefiles for the following tool- chains:
• Keil ARM RealView® Microcontroller Development System
• IAR Embedded Workbench for ARM
• Sourcery CodeBench
• Texas Instruments’ Code Composer StudioTM IDE
Download evaluation versions of these tools from the TI website. Due to code size restrictions, the evaluation tools may not build all example programs. A full license is necessary to re-build or debug all examples.
Instructions on installing and using each of the evaluation tools can be found in the Quickstart guides (for example, Quickstart-Keil, Quickstart-IAR) which are available for download from the evaluation kit section of the TI website at www.ti.com/tiva-c.
For detailed information on using the tools, see the documentation included in the tool chain installation or visit the respective web site of the tool supplier.
SPMU296–April 2013
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Software Development 13
Copyright © 2013, Texas Instruments Incorporated
Programming the Tiva C Series LaunchPad Evaluation Board www.ti.com 3.4 Programming the Tiva C Series LaunchPad Evaluation Board
The Tiva C Series LaunchPad software package includes pre-built binaries for each of the example applications. If you have installed TivaWare to the default installation path of C:\ti\TivaWare_C_Series_
Follow these steps to program example applications into the Tiva C Series LaunchPad evaluation board using the ICDI:
1. Install LM Flash Programmer on a PC running Microsoft® Windows®.
2. Switch the POWER SELECT switch to the right for Debug mode.
3. Connect the USB-A cable plug to an available port on the PC and the Micro-B plug to the Debug USB port on the board.
4. Verify that the POWER LED D4 on the board is lit.
5. Run the LM Flash Programmer.
6. In the Configuration tab, use the Quick Set control to select the EK-TM4C123GXL evaluation board.
7. Move to the Program tab and click the Browse button. Navigate to the example applications directory (the default location is C:\ti\TivaWare_C_Series_
8. Each example application has its own directory. Navigate to the example directory that you want to load and then into the directory which contains the binary (*.bin) files. Select the binary file and click Open.
9. Set the Erase Method to Erase Necessary Pages, check the Verify After Program box, and check Reset MCU After Program.
Program execution starts once the Verify process is complete.
14 Software Development
SPMU296–April 2013
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Chapter 4 SPMU296–April 2013
References, PCB Layout, and Bill of Materials
4.1 References
In addition to this document, the following references are available for download at www.ti.com:
• Tiva C Series TM4C123GH6PM Microcontroller Data Sheet (literature number SPMS376).
• LM Flash Programmer tool. Available for download at www.ti.com/tool/lmflashprogrammer.
• TivaWare for C Series Driver Library. Available for download at www.ti.com/tool/sw-tm4c-drl.
• TivaWare for C Series Driver Library User’s Manual (literature number SPMU298).
• TPS73633 Low-Dropout Regulator with Reverse Current Protection Data Sheet (literature number SBVS038)
• Texas Instruments’ Code Composer Studio IDE website: www.ti.com/ccs
Additional support:
• RealView MDK (www.keil.com/arm/rvmdkkit.asp)
• IAR Embedded Workbench (www.iar.com).
• Sourcery CodeBench development tools (www.codesourcery.com/gnu_toolchains/arm).
SPMU296–April 2013 References, PCB Layout, and Bill of Materials 15 Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Component Locations www.ti.com 4.2 Component Locations
Plots of the top-side component locations are shown in Figure 4-1 and the board dimensions are shown in Figure 4-2.
Figure 4-1. Tiva C Series LaunchPad Component Locations (Top View)
16 References, PCB Layout, and Bill of Materials SPMU296–April 2013 Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
www.ti.com
Bill of Materials (BOM)
Item Ref Des
1 C1-2, C7, C12, C14
2 C25-26, C31-32
3 C28-29
4 C3, C5, C8, C15,
C18-19, C21
Qty Description
5 Capacitor, 0402, X5R, 10 V, Low ESR
4 Capacitor, 10 pF, 50 V, 5%, NPO/COG, 0402
2 Capacitor, 24 pF, 50 V, 5%, NPO/COG, 0402
7 Capacitor, 0.01 μF 25 V, 10% 0402 X7R
Manufacturer
Johanson Dielectrics Inc
Murata
TDK
Taiyo Yuden Taiyo Yuden Murata Everlight Lite-On
3M FCI Sullins
Samtec
Manufacturer Part No
100R07X105KV4T
GRM1555C1H100JZ01D
C1005C0G1H240J
TMK105B7103KV-F
EMK105B7104KV-F
GRM188R61C225KE15D
18-038/RSGHBHC1-S02/2T
LTST-C171GKT
961102-6404-AR 68001-102HLF SPC02SYAN
SSW-110-23-S-D
5 C4, C6, C10-11, C17,
C20, C23-24 X7R
6 C9, C22
7 D1
8 D4
9 H24
10 H25
11 J1, J3
SPMU296–April 2013
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References, PCB Layout, and Bill of Materials 17 Copyright © 2013, Texas Instruments Incorporated
Figure 4-2. Tiva C Series LaunchPad Dimensions
NOTE: Units are in mils (one thousandth of an inch): 1 mil = 0.001 inch (0.0254 mm).
4.3 Bill of Materials (BOM)
Table 4-1 shows the bill of materials for the EK-TM4C123GXL evaluation board. Table 4-1. EK-TM4C123GXL Bill of Materials
8 Capacitor, 0.1 μF 16 V, 10% 0402 2 Capacitor, 2.2 μF, 16 V, 10%,
0603, X5R
1 LED, Tri-Color RGB, 0404 SMD Common Anode
1 LED, Green 565 nm, Clear 0805 SMD
1 Header, 1×2, 0.100, T-Hole, Vertical Unshrouded, 0.220 Mate
1 Jumper, 0.100, Gold, Black, Closed
2 Header, 2×10, T-Hole Vertical unshrouded stacking
Bill of Materials (BOM) www.ti.com Table 4-1. EK-TM4C123GXL Bill of Materials (continued)
Item
Ref Des
Qty
Description
Manufacturer
Manufacturer Part No
12
J11
1
USB Connector, Micro B Recept RA SMT BTTM MNT
Hirose
ZX62-B-5PA
13
J2, J4
2
Header, 1×2, 0.100, SMT, Horizontal Unshrouded, 0.230 Mate
Samtec
TSM-110-01-S-DH-A-P-TR
4UCON
10995
Major League Electronics
TSHSM-110-D-02-T-H-AP- TR-P-LF
14
J9
1
USB Connector, Micro A/B Receptacle SMD
Hirose
ZX62-AB-5PA
15
Q1-3
3
NPN SC70 pre-biased
Diodes Inc
DTC114EET1G
16
R1-2, R9-16, R20, R26
12
Resistor, 0 Ω 1/10W 0603 SMD
Panasonic
ERJ-3GEY0R00V
17
R18-19, R21-23, R28
6
Resistor, 10 kΩ, 1/10W, 5%, 0402 Thick Film
Yageo
RC0402FR-0710KL
18
R3-5, R8, R27
5
Resistor, 330 Ω, 1/10W, 5%, 0402
Yageo
RC0402FR-07330RL
19
R31
1
Resistor, 1 MΩ 1/10W, 5%, 0402
Rohm
MCR01MRTF1004
20
RESET SW1, SW2
3
Switch, Tact 6 mm SMT, 160gf
Omron
B3S-1000
21
SW3
1
Switch, DPDT, SMT 300 mA × 2 at 6V
C K Components
JS202011SCQN
22
U1, U2
2
Tiva C Series MCU TM4C123GH6PM
Texas Instruments
TM4C123GH6PMI
23
U8
1
Regulator, 3.3 V, 400 mA, LDO
Texas Instruments
TPS73633DRBT
24
Y1
1
Crystal, 32.768 kHz Radial Can
Abracon
AB26TRB-32.768KHZ- T
25
Y2, Y5
2
Crystal, 16.00 MHz 5.0×3.2mm SMT
NDK
NX5032GA-16.000000 MHz
Abracon
ABM3-16.000 MHz-B2- T
PCB Do Not Populate List (Shown for information only)
26
C31, C34
2
Capacitor, 0.1 μF 16 V, 10% 0402 X7R
Taiyo Yuden
EMK105B7104KV-F
27
D2
1
Diode, Dual Schottky, SC70, BAS70 Common Cathode
Diodes Inc
BAS70W-05-7-F
28
R17
1
Resistor, 10 kΩ 1/10W 5%, 0402 Thick Film
Yageo
RC0402FR-0710KL
29
R24
1
Resistor, 330 Ω, 1/10W, 5%, 0402
Yageo
RC0402FR-07330RL
30
R25, R29-30
3
Resistor, 0 Ω, 1/10W 0603
Panasonic
ERJ-3GEY0R00V
31
U4
1
IC, Single Voltage Supervisor, 5V, DBV
Texas Instruments
TLV803MDBZR
18 References, PCB Layout, and Bill of Materials SPMU296–April 2013 Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Appendix A SPMU296–April 2013
Schematics
This section contains the complete schematics for the Tiva C Series LaunchPad board.
• Microcontroller, USB, Expansion, Buttons, and LED
• Power Management
• In-Circuit Debug Interface
SPMU296–April 2013
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Schematics 19
Copyright © 2013, Texas Instruments Incorporated
GPIO
PA0/U0RX_VCP_TXD PA1/U0TX_VCP_RXD
DEBUG_PC0/TCK/SWCLK DEBUG_PC1/TMS/SWDIO DEBUG_PC2/TDI DEBUG_PC3/TDO/SWO
17 PA0
18 PA1
19 PA2
20 PA3
21 PA4
22 PA5
23 PA6
24 PA7
52 PC0 51 PC1 50 PC2 49 PC3 16 PC4 15 PC5 14 PC6 13 PC7
PB0 45
PB1 46
PB2 47
PB3 48
PB4 58
PB5 57
PB6 1
PB7 4
PD0 61
PD1 62
PD2 63
PD3 64
PD4 43
PD5 44
PD6 53
PD7 10
PF0 28
PF1 29
PF2 30
PF3 31
PF4 5
PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7
PD0 PD1 PD2 PD3
PD6 PD7
PF0 PF1 PF2 PF3 PF4
0R1 0R2 0 R11 0 R12 0 R13
0
LED_R
LED_G
LED_B
B
B
B
C
E
C
E
C
+VBUS
DEBUG/VCOM
U1-A
J9 CON-USB-MICROAB
PA2 PA3 PA4 PA5 PA6 PA7
PC4 PC5 PC6 PC7
PE0 PE1 PE2 PE3 PE4 PE5
9 7R14 86
E
R3 330
Q1 DTC114EET1G
R5 330
USR_SW1
USR_SW2
WAKE
PF0
PB7 PB6 PA4 PA3 PA2
PF2
PF3
Q3 DTC114EET1G
RGB_LED_0404_COMA
Q2 DTC114EET1G
9 PE0 8 PE1 7 PE2 6 PE3
J1 and J2 provide compatability with
Booster Packs designed for MSP430 Launchpad
J3 and J4 sit 100 mils inside J1 and J2 to provide
extended functions specific to this board.
See the board user manual for complete table of pin mux functions
GPIO
59 PE4
60 PE5
TM4C123G
D1 2R
3GA1 4B
R8 330
USB_DM USB_DP
PB0
USB_DP
USB_DM
0
R25
GPIO
5 4 3 2 1
G ID
D+ D-
VB
DGT
R4 R
330
TIVA MICROCONTROLLERS 108 WILD BASIN ROAD, SUITE 350 AUSTIN TX, 78746 www.ti.com
+USB_VBUS
0 R29
PB1
USR_SW2 J1
+3.3V
LED_R LED_B LED_G USR_SW1
PD0 PD1
0
R9 0
R10
SW1
SW2
PB6 PB7
1
2 PB5 PB2
3 PB0 PE0
J2
1 2 3 4
TARGETRST 5 6
7 8 9
10 CON_110_100
J4
1 2 3 4 5 6 7 8 9
10 CON_110_100
TEXAS INSTRUMENTS
DESIGNER
REVISION
0.3
PROJECT
Tiva TM4C123G LaunchPad
DESCRIPTION
Microcontroller, USB, Expansion, Buttons and LED
FILENAME
EK-TM4C123GXL Rev A.sch
PART NO.
EK-TM4C123GXL
SHEET
1 OF 3
4 PB1
5 PE4
6 PE5
7 PB4
8 PA5
9 PA6
10 PA7
CON_110_100
+VBUS
J3
1 2
3 PD0 PB3
4 PD1 PC4
5 PD2 PC5
6 PD3 PC6
7 PE1 PC7
8 PE2 PD6
9 PE3 PD7
10 PF1 PF4
CON_110_100
DATE
2/20/2013
+MCU_PWR
R28 10k
C13 0.1uF OMIT
GND 10pF10pFGNDVDDCC
RESET
RESET
Y2 16MHz
H20
+USB_VBUS H18
TARGETRST
H24 and H25 installed as a single 1×2 header on 100 mil center with jumper
+ICDI_VBUS H19
Power Select
SW3
1 3 6
5 4
+3.3V 400mA Regulator
U8 TPS73633DRB
81 3
+VBUS
H21
+MCU_PWR H24
H25
RESET
WAKE
WAKE
+3.3V
U1-B
0
R30 OMIT
C7 1.0uF
2
38
41 40
34
3 12
GND
32
33
OSC1 HIB HIB
OSC0
XOSC0 GNDX XOSC1
GNDA
37
VDDA
VBAT
35
2
36
VDD VDD VDD 54 VDD
11
26
C3 0.01uF
C4 0.1uF
C5 0.01uF
C6 0.1uF
C8 0.01uF
42
C31 C32
27
39
+
MCU_VDD
C12 1.0uF
55
GND VDDC TM4C123G
25 56
+3.3V
32.768Khz Y1
C10 0.1uF
C11 0.1uF
+VBUS
C14 1.0uF
H17 H23
H22
C18 0.01uF
C22 2.2uF
IN OUT
EN NR GND PAD
5
H13
H10
H11
H12
+VBUS
+3.3V
R17 10k
D2
TLV803
A 1
23 3KA2
1 U4
TARGETRST ICDI_RST
RESET VDD
GND
OMIT this SVS Section for Tiva. Errata Fixed
DESIGNER DGT
PROJECT
Tiva Launchpad
REVISION 0.3
DATE 2/20/2013
DESCRIPTION
Power Management
FILENAME
EK-TM4C123GXL Rev A.sch
PART NO.
EK-TM4C123GXL
SHEET
2 OF 3
TEXAS INSTRUMENTS
R
TIVA MICROCONTROLLERS
108 WILD BASIN ROAD, SUITE 350 AUSTIN TX, 78746
www.ti.com
Green
330 R27
D4
4 9
H2
C28 24pF
C29 24pF
R26 0
H1
1M R31
DEBUG/VCOM
In-Circuit Debug Interface (ICDI)
PA1/U0TX_VCP_RXD PA0/U0RX_VCP_TXD
DEBUG_PC0/TCK/SWCLK DEBUG_PC1/TMS/SWDIO DEBUG_PC3/TDO/SWO DEBUG_PC2/TDI
+MCU_PWR
+3.3V
+ICDI_VBUS
R18 R23 10k 10k
U2-A
17 45 18 46
19 20 21 22 23 24
52
51
50
49
16
15 44 14 53 13 10
9 28 8 29 7 30 6 31
59 5 60
TM4C123G
R24
DEBUG_PC3/TDO/SWO
DEBUG_PC1/TMS/SWDIO DEBUG_PC0/TCK/SWCLK
47 48 58 57 1 4
61 62 63 64 43
330
TARGETRST
ICDI_TCK ICDI_TMS ICDI_TDI ICDI_TDO
EXTDBG +3.3V
R21 10k
H14
R22 10k
1 2 3 4 5
VB D-
D+ 0
ID G
R16
+3.3V
R19 10k
ICDI_RST
Y5 16MHz
C25 C26 10pF 10pF
C34 0.1uF OMIT
+3.3V
ICDI JTAG
J5 56
U2-B
38
41 40
34 35 36
3 12
32 33 37 2 11
54
25 56
ICDI_TCK 47 38
ICDI_TDO ICDI_TDI ICDI_RST
RESET WAKE
OSC1 HIB OSC0
VBAT
XOSC0
GNDX VDDA XOSC1
VDD
VDD GNDA VDD VDD
GND
GND
GND VDDC GND VDDC
+3.3V ICDI_TMS
29 110
TC2050-IDC-NL
39
26
C15 0.01uF
C17 0.1uF
C19 0.01uF
C20 0.1uF
C21 0.01uF
PA0 PB0
PA1 PB1
PA2 PB2
PA3 PB3
PA4 PB4
PA5 PB5
PA6 PB6
PA7 PB7
PC0 PD0
PC1 PD1
PC2 PD2
PC3 PD3
PC4 PD4
PC5 PD5
PC6 PD6
PC7 PD7
PE0 PF0
PE1 PF1
PE2 PF2
PE3 PF3
PE4 PF4
PE5
C1 1.0uF
42
27
55
C23 0.1uF
C24 0.1uF
C2 1.0uF
TM4C123G
C9 2.2uF
DESIGNER DGT
REVISION 0.3
DATE 2/20/2013
PROJECT
Tiva TM4C123G LaunchPad
DESCRIPTION
In Circuit Debug Interface
FILENAME
EK-TM4C123GXL Rev A.sch
PART NO.
EK-TM4C123GXL
SHEET
3 OF 3
TEXAS INSTRUMENTS
R
TIVA MICROCONTROLLERS
108 WILD BASIN ROAD, SUITE 350 AUSTIN TX, 78746
www.ti.com
R20 0
86 97
CON-USB-MICROB J11
H15
EVALUATION BOARD/KIT/MODULE (EVM) ADDITIONAL TERMS
Texas Instruments (TI) provides the enclosed Evaluation Board/Kit/Module (EVM) under the following conditions:
The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claims arising from the handling or use of the goods.
Should this evaluation board/kit not meet the specifications indicated in the User’s Guide, the board/kit may be returned within 30 days from the date of delivery for a full refund. THE FOREGOING LIMITED WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE, NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES.
Please read the User’s Guide and, specifically, the Warnings and Restrictions notice in the User’s Guide prior to handling the product. This notice contains important safety information about temperatures and voltages. For additional information on TI’s environmental and/or safety programs, please visit www.ti.com/esh or contact TI.
No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, or combination in which such TI products or services might be or are used. TI currently deals with a variety of customers for products, and therefore our arrangement with the user is not exclusive. TI assumes no liability for applications assistance, customer product design, software performance, or infringement of patents or services described herein.
REGULATORY COMPLIANCE INFORMATION
As noted in the EVM User’s Guide and/or EVM itself, this EVM and/or accompanying hardware may or may not be subject to the Federal Communications Commission (FCC) and Industry Canada (IC) rules.
For EVMs not subject to the above rules, this evaluation board/kit/module is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end product fit for general consumer use. It generates, uses, and can radiate radio frequency energy and has not been tested for compliance with the limits of computing devices pursuant to part 15 of FCC or ICES-003 rules, which are designed to provide reasonable protection against radio frequency interference. Operation of the equipment may cause interference with radio communications, in which case the user at his own expense will be required to take whatever measures may be required to correct this interference.
General Statement for EVMs including a radio
User Power/Frequency Use Obligations: This radio is intended for development/professional use only in legally allocated frequency and power limits. Any use of radio frequencies and/or power availability of this EVM and its development application(s) must comply with local laws governing radio spectrum allocation and power limits for this evaluation module. It is the user’s sole responsibility to only operate this radio in legally acceptable frequency space and within legally mandated power limitations. Any exceptions to this are strictly prohibited and unauthorized by Texas Instruments unless user has obtained appropriate experimental/development licenses from local regulatory authorities, which is responsibility of user including its acceptable authorization.
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant Caution
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.
FCC Interference Statement for Class A EVM devices
This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense.
FCC Interference Statement for Class B EVM devices
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.
For EVMs annotated as IC – INDUSTRY CANADA Compliant
This Class A or B digital apparatus complies with Canadian ICES-003.
Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.
Concerning EVMs including radio transmitters
This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.
Concerning EVMs including detachable antennas
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication.
This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.
Cet appareil numérique de la classe A ou B est conforme à la norme NMB-003 du Canada.
Les changements ou les modifications pas expressément approuvés par la partie responsable de la conformité ont pu vider l’autorité de l’utilisateur pour actionner l’équipement.
Concernant les EVMs avec appareils radio
Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence. L’exploitation est autorisée aux deux conditions suivantes : (1) l’appareil ne doit pas produire de brouillage, et (2) l’utilisateur de l’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d’en compromettre le fonctionnement.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d’Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d’un type et d’un gain maximal (ou inférieur) approuvé pour l’émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l’intention des autres utilisateurs, il faut choisir le type d’antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l’intensité nécessaire à l’établissement d’une communication satisfaisante.
Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d’antenne énumérés dans le manuel d’usage et ayant un gain admissible maximal et l’impédance requise pour chaque type d’antenne. Les types d’antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l’exploitation de l’émetteur.
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【Important Notice for Users of this Product in Japan】 This development kit is NOT certified as Confirming to Technical Regulations of Radio Law of Japan
If you use this product in Japan, you are required by Radio Law of Japan to follow the instructions below with respect to this product:
1. Use this product in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of Japan,
2. Use this product only after you obtained the license of Test Radio Station as provided in Radio Law of Japan with respect to this product, or
3. Use of this product only after you obtained the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect to this product. Also, please do not transfer this product, unless you give the same notice above to the transferee. Please note that if you could not follow the instructions above, you will be subject to penalties of Radio Law of Japan.
http://www.tij.co.jp
【ご使用にあたっての注】
Texas Instruments Japan Limited
(address) 24-1, Nishi-Shinjuku 6 chome, Shinjuku-ku, Tokyo, Japan
本開発キットは技術基準適合証明を受けておりません。
本製品のご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。
1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用いただく。
2. 実験局の免許を取得後ご使用いただく。
3. 技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。
日本テキサス・インスツルメンツ株式会社 東京都新宿区西新宿6丁目24番1号 西新宿三井ビル
http://www.tij.co.jp
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EVALUATION BOARD/KIT/MODULE (EVM) WARNINGS, RESTRICTIONS AND DISCLAIMERS
For Feasibility Evaluation Only, in Laboratory/Development Environments. Unless otherwise indicated, this EVM is not a finished electrical equipment and not intended for consumer use. It is intended solely for use for preliminary feasibility evaluation in laboratory/development environments by technically qualified electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components, systems and subsystems. It should not be used as all or part of a finished end product.
Your Sole Responsibility and Risk. You acknowledge, represent and agree that:
1. You have unique knowledge concerning Federal, State and local regulatory requirements (including but not limited to Food and Drug Administration regulations, if applicable) which relate to your products and which relate to your use (and/or that of your employees, affiliates, contractors or designees) of the EVM for evaluation, testing and other purposes.
2. You have full and exclusive responsibility to assure the safety and compliance of your products with all such laws and other applicable regulatory requirements, and also to assure the safety of any activities to be conducted by you and/or your employees, affiliates, contractors or designees, using the EVM. Further, you are responsible to assure that any interfaces (electronic and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electrical shock hazard.
3. You will employ reasonable safeguards to ensure that your use of the EVM will not result in any property damage, injury or death, even if the EVM should fail to perform as described or expected.
4. You will take care of proper disposal and recycling of the EVM’s electronic components and packing materials.
Certain Instructions. It is important to operate this EVM within TI’s recommended specifications and environmental considerations per the user guidelines. Exceeding the specified EVM ratings (including but not limited to input and output voltage, current, power, and environmental ranges) may cause property damage, personal injury or death. If there are questions concerning these ratings please contact a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the specified output range may result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or interface electronics. Please consult the EVM User’s Guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative. During normal operation, some circuit components may have case temperatures greater than 60°C as long as the input and output are maintained at a normal ambient operating temperature. These components include but are not limited to linear regulators, switching transistors, pass transistors, and current sense resistors which can be identified using the EVM schematic located in the EVM User’s Guide. When placing measurement probes near these devices during normal operation, please be aware that these devices may be very warm to the touch. As with all electronic evaluation tools, only qualified personnel knowledgeable in electronic measurement and diagnostics normally found in development environments should use these EVMs.
Agreement to Defend, Indemnify and Hold Harmless. You agree to defend, indemnify and hold TI, its licensors and their representatives harmless from and against any and all claims, damages, losses, expenses, costs and liabilities (collectively, “Claims”) arising out of or in connection with any use of the EVM that is not in accordance with the terms of the agreement. This obligation shall apply whether Claims arise under law of tort or contract or any other legal theory, and even if the EVM fails to perform as described or expected.
Safety-Critical or Life-Critical Applications. If you intend to evaluate the components for possible use in safety critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, such as devices which are classified as FDA Class III or similar classification, then you must specifically notify TI of such intent and enter into a separate Assurance and Indemnity Agreement.
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